Symposium VII-C:

Mechanics and Physics of Soft Materials

Symposium Organizers:

S. Rudykh, Technion, Israel Institute of Technology
T. Sain, Michigan Technological University
Y. Hu, University of Illinois Urbana-Champaign
O. Lopez-Pamies, University of Illinois Urbana-Champaign
X. Zhao, Massachusetts Institute of Technology
L. Jin, University of California Los Angeles


Symposium Description:

Soft materials is an increasingly active field of research driving science and technology into new exciting directions. Large deformations coupled with various multiphysics phenomena and instabilities at different length scales open an immensely rich research arena. This offers unique opportunities to develop multifunctional materials and devices with novel properties, through the targeted design of material composition and microstructural layout. Moreover, soft materials represent an essential component in biological tissues, a topic of extreme interest for bio-medical applications. This mini-symposium will address recent experimental, computational, theoretical and manufacturing advances in this direction. Topics of particular interest include:

  • Electroactive and magnetoactive elastomers (EAP, DE, MRE, MAE)
  • Hydrogels and soft wet materials
  • Liquid crystal elastomers
  • Shape-memory and light-sensitive polymers
  • Ionic Polymer-Metal Composites (IPMC)
  • Microstructural instabilities, fracture, and adhesion in soft materials
  • Soft biological and bio-inspired materials
  • Multiphysics phenomena in soft materials
  • Wave propagation in soft materials
  • 3D/4D printing and fabrication of soft materials
  • Soft Robotics or Machines