Facility Information

Materials Growth Technique:

Automated 6-target physical vapor deposition (PVD) system
Vacuum plasma melting system
Two spin spray systems for ferrite thin films
Electrochemical plating system with EG&G PAR 273 Potentiostat/Galvanostat
Sol-gel processing facilities
Physical vapor deposition
Electrochemical deposition
Pulsed Laser Deposition (PLD)
The Nano-PLD
Liquid phase epitaxial (LPE)
Ceramic synthesis: Ball milling, compression, and sintering
Screen Printer
Annealing furnace (up to ~1700°C)
Computer controlled machine tool

Major Characterization Technique:

Radiant Ferroelectric Testing System
Broadband magnetoelectric testing system
Narrowband magnetoelectric testing system
Magnetostriction tester
Broadband 0.5~15 GHz frequency-sweep permeameter
Magneto-optical Kerr imaging system
KLA Tencor profilometer
SHB 108 BH Looper
Microwave probe station
Physical Property Measurement System (PPMS)
Ferromagnetic resonance spectroscopy (FMR) at 8~12 GHz, 30~55 GHz
0.45~110 GHz broadband HP network analyzer 8510
Vibrating sample magnetometer (VSM)
Magnetostriction tester for magnetic and magnetoelectric films
X-ray diffraction (XRD)
Fourier Transform Infrared (FTIR) spectrometer
Extended X-ray absorption fine structure (EXAFS) analysis
Scanning Probe Microscope (SPM)
X-ray magnetic circular dichorism (XMCD)
Scanning electron microscopy (SEM)
X-ray photoelectron spectroscopy (XPS)
Auger electron spectroscopy (AES)

Electromagnetics Simulation Software:

HFSS for RF and microwave simulations from Ansoft
Maxwell 2-D and 3-D from Ansoft

Facilities in the NSF Center for High-rate Nanomanufacturing (CHN):on campus at Northeastern University. PI is an affiliated member with this Center, and has access to all facilities in CHN. This Center consists of 7000 ft² of class 10/100 clean room space and CMOS and MEMS fabrication and characterization facilities. Facilities include state-of-the-art CVD system for carbon nanotubes, field emission Scanning Electron Microscope with e-beam lithography, instruments for photolithography, reactive ion etching, ion milling, physical vapor deposition, and wet chemical processing, a precision alignment nanoimprint lithography system, a Multimode SPM and Nanomanipulator AFM System, and a surface energy analysis system, etc.

Major Equipment:

Automated 6-target physical vapor deposition (PVD) system in Dr. Sun’s lab. This is UHV system with substrate heating and rotation, and in-situ magnetic field during deposition, which also serves as a vacuum magnetic field annealing system.